| 摘要 |
The epoxy resin for sealing a semiconductor device is composed of epoxy resin, phenol resin, organic and inorganic flame retardants, a modifier, an inorganic filler and other additives. The inorganic filler comprises the mixture of high purity, molten, spherical type silica and pulverized type silica, its mean particle sizes being 10-50 and 20-30 micrometer, and 80-90 wt% of the filler being added. This epoxy composition enhances the fluidity, crack resistance, delamination resistance and diminishes the internal stress according to difference in thermal expansion coefficients of a package.
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