METHOD FOR MANUFACTURING OF SEMICONDUCTOR PACKAGE

摘要

The semiconductor package manufacturing method comprises the steps of: connecting a chip pad on a chip and a board pad of a multi-layered flexible circuit board by using an adhesive; arranging a reed in the form that the metal line of each board pad is arranged in one direction; bonding the bonded boards of the chip by the adhesive; polishing the chip and multi-layered flexible circuit board to expose the reed; and connecting the exposed reed to a substrate by using the adhesive.