发明名称 PLASTIC PACKAGE MOLD EJECT DEVICE
摘要 The apparatus includes upper and lower mold dies (20,21), upper and lower mold cavities (22,23) clamped to each other with a lead frame (24) in between, upper and lower discharge block moving plates (27,28) for separating the mold product from the dies (20,21), upper and lower discharge block moving washers (25,26), and upper and lower discharging blocks (29,30) formed in the cavities (22,23) in block shapes, thereby widening the contact area of the discharging block (29,30) to discharge the mold package and the lead frame (24) smooth.
申请公布号 KR950005448(B1) 申请公布日期 1995.05.24
申请号 KR19920010950 申请日期 1992.06.23
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 SON, HAE - JONG
分类号 H01L23/28;(IPC1-7):H01L23/28 主分类号 H01L23/28
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