| 摘要 |
PURPOSE:To provide a semiconductor integrated circuit device manufacturing method by which the carrying efficiency of ceramic packages can be improved and the pattern recognizing time can be shortened at the time of bonding. CONSTITUTION:After forming multiple ceramic packages 2 in a block-like state by forming dividing grooves 7a between each package 2 and performing die bonding, wire bonding, and airtight sealing, the packages 2 are divided into individual packages 2. Since the multiple packages 2 can be supplied to a manufacturing process as they are, the carrying efficiency of the packages 2 can be improved and the need of a carrier for mounting the packages 2 is eliminated. In addition, since the blocked packages 2 can be recognized as one pattern, the pattern recognizing time can be shortened at the time of bonding. |
