| 摘要 |
PURPOSE:To improve the effectiveness of defect inspection work by an operator by displaying only the defects which are easily overlooked in the center of a monitoring screen when an image in which a defect is found is displayed on the monitor for confirmation. CONSTITUTION:A wafer 1 exposed by using an reticle to be inspected is prepared and mounted on a X-Y stage. A same pattern, e. g. chip patterns A21, B22, is transfered to the exposed area 2 of one time exposure in the wafer 1. Then, the images of the light receiving areas 31A, 32B of the chip patterns A21, B22 are transfered as read out images on a monitoring screen. If there is a defect in a light receiving area a31, the defect is transferred to the read out images. Those images are compared one another and only the image in which a defect is found is displayed. The defect confirmation by image comparison in this way is carried out for the whole light receiving areas a31, b32 and the address of the defect is simultaneously detected. In the case the range of the defect is within a set range, the image of the defect is displayed in the center of the monitoring screen to make the confirmation easy. |
