Tray for semiconductor devices

摘要

A tray for semiconductor devices is used by piling up another tray or other trays on this tray. Rectangular pockets are formed on the upper surface of the trays and each of the pockets houses a semiconductor device. A base projects upward from each pocket to support each semiconductor device. The base has a similar shape to and is larger than the undersurface of the semiconductor device. Parallel guide ribs are formed on the undersurface of each tray and each is provided with an tapered inner face inclined downward outward of the base. The roots of the adjacent guide ribs define a portion of the undersurface of the trays which has a similar shape to and is smaller than the upper surface of the semiconductor device. The guide ribs are arranged to provide a horizontal play between the outer edge portions on the upper surface of the semiconductor device and the tapered inner face. An upwardly projecting holding mechanism extends along the outer edge portions. Its root portions surround a portion of the upper surface of the base which has a similar shape to and is not smaller than the undersurface of the semiconductor device. The projecting holding mechanism is arranged to cause the bottom portion of the semiconductor device to be fitted in the portion of the base surrounded by the upwardly projecting holding mechanism.