| 摘要 |
PURPOSE:To suppress the sticking of photomasks to wafers by a method wherein the surface of photoresist films are dried after workpiece coated with the photoresist films are heated from rear surface side to be baked. CONSTITUTION:The wafers 4 coated with photoresist films 5 are heated from rear surface side on a plurality of hot plate heaters 3 so as to evaporate the solvent in the photoresist films. At this time, a far infrared radiation heater 6 is arranged on the above position of the outermost side hot plate heater 3 so that the water 4 on the outermost side hot plate heater 3 may be heated from rear surface side simultaneously the surface of the photoresist film 5 may be radiated from the far infrared radiation heater 6 to accelerate the drying up of the surface of the photoresist films 5 for setting the same. Through these procedures, even if photomasks are made closely adhere to the photoresist films 5 on the wafers 4 in the next contact exposure step, the sticking phenomenon of the photomasks to wafers 4 can be suppressed. |
