发明名称 LAMINATED THREE-DIMENSIONAL SEMICONDUCTOR INTEGRATED CIRCUIT
摘要 PURPOSE:To make the characteristics of pixels uniform even when the umber of the pixels increase so as to improve the sensing abilities of circuit blocks by wiring power supply lines and grounding lines to lower-layer areas from power supply wiring and grounding wiring in sensing areas by using through holes. CONSTITUTION:Power supply lines 51 and grounding lines 52 in an A/D converter area 24 are respectively connected to power supply wiring 41 and grounding wiring 42 formed of low-resistance wires at every pixel through holes. Power supply lines 61 and grounding lines 62 in a logic circuit area 34 are respectively connected to the power supply wiring 41 and grounding wiring 42 formed of low-resistance wires at every pixel through holes. The difference in degree of voltage drop between the wirings 41 and 42 due to the position of each pixel is small and an almost the same voltage is supplied to each pixel. Therefore, the characteristics of a sensor can be improved.
申请公布号 JPH07135293(A) 申请公布日期 1995.05.23
申请号 JP19900107472 申请日期 1990.04.25
申请人 MITSUBISHI ELECTRIC CORP 发明人 KUMAMOTO TOSHIO
分类号 H01L25/18;H01L21/3205;H01L23/52;H01L25/065;H01L25/07;H01L25/16;H01L27/00;(IPC1-7):H01L27/00 主分类号 H01L25/18
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