发明名称 Method of manufacturing laminated electronic component
摘要 A method of manufacturing a laminated electronic component such as a laminated ceramic capacitor, for example, which includes the steps of preparing a ceramic sheet provided with orientation marks, punching the ceramic sheet on the basis of the positions of the orientation marks, and stacking such ceramic sheets on the basis of the positions of the orientation marks. The punching step and the stacking step, which require alignment, are carried out on the basis of the positions of the orientation marks, whereby the ceramic sheets are stacked with high accuracy of alignment in the laminated electronic component as obtained.
申请公布号 US5417784(A) 申请公布日期 1995.05.23
申请号 US19930010444 申请日期 1993.01.22
申请人 MURATA MANUFACTURING CO., LTD. 发明人 KOBAYASHI, MOTOO;TANAKA, YUKIO;KAWABATA, SHOICHI;KOGAME, TOSHIHIKO
分类号 H01G4/12;B32B18/00;H01G4/30;H01L21/70;H01L23/544;H05K1/02;H05K1/03;H05K1/09;H05K3/00;H05K3/46;(IPC1-7):B32B31/04 主分类号 H01G4/12
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