POLISHING POST-TREATMENT FOR SUBSTRATE AND POLISHING DEVICE TO BE USED FOR THIS,申请号JP19930279384-传众专利搜索

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发明名称	POLISHING POST-TREATMENT FOR SUBSTRATE AND POLISHING DEVICE TO BE USED FOR THIS
摘要
申请公布号	JPH07135192(A)	申请公布日期	1995.05.23
申请号	JP19930279384	申请日期	1993.11.09
申请人	SONY CORP	发明人	HAYAKAWA HIDEAKI
分类号	B08B3/02;B24B37/04;H01L21/304;H01L21/3105;H01L21/677;H01L21/68;(IPC1-7):H01L21/304	主分类号	B08B3/02
代理机构		代理人
主权项
地址

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