| 发明名称 |
Conductive materials based on encapsulated conductive polymers |
| 摘要 |
A material based on a conductive polymer consisting of particles of conductive polymer (P0), each particle being wrapped in a shell of water-insoluble, cross-linked polymer (P1).
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| 申请公布号 |
US5417890(A) |
申请公布日期 |
1995.05.23 |
| 申请号 |
US19920897828 |
申请日期 |
1992.06.12 |
| 申请人 |
THOMSON-CSF |
发明人 |
EPRON, FLORENCE;HENRY, FRANCOIS;SAGNES, OLIVIER;DUBOIS, JEAN-CLAUDE |
| 分类号 |
C09D5/24;H01B1/12;(IPC1-7):H01B1/00 |
主分类号 |
C09D5/24 |
| 代理机构 |
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| 地址 |
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