发明名称 |
Copper paste for forming conductive thick film |
摘要 |
Disclosed herein is copper paste for forming a conductive thick film, which contains 80 wt. % to 95 wt. % of spherical first copper powder of 1 mu m to 10 mu m in mean particle diameter, 0.5 wt. % to 15 wt. % of second copper powder of less than 1 mu m in mean particle diameter, and 1 wt. % to 15 wt. % of glass frit of 0.5 mu m to 2.0 mu m in mean particle diameter respectively as solid components. A conductive thick film obtained by applying the copper paste onto a substrate and baking the same exhibits excellent solderability as well as high adhesive strength to the substrate, and this adhesive strength is excellently maintained even if the thick film is exposed to a heat hysteresis.
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申请公布号 |
US5418193(A) |
申请公布日期 |
1995.05.23 |
申请号 |
US19940238256 |
申请日期 |
1994.05.04 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
TANI, HIROJI;OSHITA, KAZUHITO;IKEDA, TETSUYA |
分类号 |
C09D5/24;C03C8/18;H01B1/00;H01B1/16;H05K1/09;(IPC1-7):C03C8/18;C03C8/16 |
主分类号 |
C09D5/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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