MANUFACTURE OF SEMICONDUCTOR DEVICE

摘要

PURPOSE:To easily and quickly form desired leads by relatively moving each lead against a sheet metal from which the leads are obtained along a designated locus at a highly energizing point. CONSTITUTION:The unnecessary part of a sheet metal 15 is removed by moving a table 54 in the X- and Y-axis directions along a designated locus by means of an NC device 55 at a highly energizing point at which an impulse voltage is applied across a wire electrode 50 and the sheet metal 15. By removing the unnecessary part, two tab hanging leads 7 which support a tab 3 at nearly the center of the sheet metal 15 and the inner sections 8 of multiple leads which are arranged around the tab 3 are integrally formed. Then the electrode pads 2a of pellets 2 fixed on the tab 3 are bridged to the front end sections of the inner parts 8 of the leads by bonding wires 4. Since no cutting die is required, desired leads can be manufactured in a short time.