| 摘要 |
PURPOSE:To enable a semiconductor device to be easily inspected after protrudent electrodes are provided and to cope with many contact points even if it is small in size by a method wherein the protrudent electrodes and a wiring material are connected together with solder. CONSTITUTION:A solder 106 1/10 to 3/4 as thick as a protrudent electrode 107 is provided around it. Thereafter, a flexible film 201 provided with through- holes 203 corresponding to the protrudent electrodes 107 and a wiring material 202 is made to cover a semiconductor device 101 provided with the protrudent electrode 107 from above. After the semiconductor device 101 is covered with the flexible film 201, the device 101 is heated to fuse the solder 106 provided around the root of the protrudent electrode 107 to connect the protrudent electrode 107 to the wiring material 202 of the flexible film 201 with the solidified solder 106. A semiconductor device 101 inspection probe is brought into contact with the wiring material 202 of the flexible film 201 to check that the semiconductor device 101 is defective or non-defective. The semiconductor device 101 and the flexible film 201 are covered with an insulating resin 204, and thus a semiconductor device is obtained.
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