| 摘要 |
<p>PURPOSE:To eliminate the need for removing insulating sections at the time of assembling, testing, and mounting a semiconductor device so as to prevent the deformation of outer leads by installing a prescribed number of bar-like insulating sections across outer leads. CONSTITUTION:A prescribed number of outer leads 23 extend in four directions from the four sides of a package 22 and formed in the shape of gull wings. Two insulating tie bars 24 having insulating sections at their extended parts and front end parts are installed across the leads 23. The tie bars 24 are formed of a heat resistant insulator which can withstand the reflow temperature of solder at the time of mounting and, at the same time, the tie bars 24 are made thinner than those of the leads 23. Therefore, the flatness of the leads 23 can be secured, because the deformation of the leads 23 can be prevented.</p> |
