发明名称 ELECTRONIC COMPONENT
摘要 <p>PURPOSE:To prevent defective soldering of electronic components having a plurality of leads extended from its main body by coating the upper surfaces of the front end sections of the leads with a heat absorbing material. CONSTITUTION:The upper surfaces 3b-8b of the front end sections of a plurality of leads 3-8 of an electronic component 1 are coated with black films M comoposed of a heat absorbing material. When heat 13 penetrates the coating sections at the time of soldering, the heat 13 is absorbed by the lead 3 and the temperature of the front end section A of the lead 3 rises, but the temperature at the bent section B and its vicinity of the lead 3 becomes lower than that at the front end section A, because the section B and its vicinity is not coated with the film M. Therefore the front end section A of the leads 3 can be jointed to a circuit pattern 10 with a sufficiently high jointing strength, because the temperature at the front end section A of the lead 3 quickly rises and the solder at the section A and its vicinity melts earlier than that at the other part.</p>
申请公布号 JPH07135287(A) 申请公布日期 1995.05.23
申请号 JP19930279750 申请日期 1993.11.09
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 SAKAI TADAHIKO;MAEDA KEN
分类号 H05K3/34;H01L23/50;(IPC1-7):H01L23/50 主分类号 H05K3/34
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