| 摘要 |
A semiconductor laser device element substrate includes a plurality of semiconductor laser device elements arranged in an array on a semiconductor substrate, the array including a plurality of rows and a plurality of columns, laser resonator facets being located at the boundaries between respective rows of the semiconductor laser device elements, and element separation guiding grooves, for guiding separation of the substrate into a plurality of divided semiconductor laser devices, the grooves being located at the boundaries between the semiconductor laser device elements of the respective columns, wherein the element separation guiding grooves are arranged at positions on different straight lines running in the column direction for each group at least two adjacent rows. Therefore, even if some forces are applied to the substrate, the forces are not concentrated on a point, whereby wafer cracking can be prevented.
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