METHOD AND DEVICE FOR CUTTING DUMB BAR AND SEMICONDUCTOR DEVICE

摘要

PURPOSE:To provide such a dumb bar cutting method and cutting device that the flatness accuracy and lead pitch accuracy of front end sections of leads after bending the leads can be improved and the occurrence of troubles by the falling down of dross can be prevented. CONSTITUTION:After setting a semiconductor device 1 on an X-Y table 11a, a dam bar 4 is cut from its surface by irradiating the device 1 with a laser beam from a laser machining head 15a from its surface side while the device 1 is moved in a horizontal plane by means of the table 11a. Then the device 1 is turned over by means of an turn-over device 12 and the turned-over device 1 is set on another X-Y table 11b. Then the cut part of the dumb bar 4 is processed from its rear side by irradiating the device 1 with a laser beam from another laser machining head 15b from its rear surface side while the device 1 is moved in a horizontal plane by means of the table 11b.