| 摘要 |
<p>The proposed adhesion compound consists of the following components (in wt %): a modifying additive; a heterocyclic compound containing a nitrogen heteroatom with a melting point of below 200 °C and a boiling point of above 250 °C - 0.5-4.0; a mineral filler -1.0-10.0; an ethylene copolymer with vinyl acetate or polyethylene or a mixture of the two - the remainder.</p> |
