发明名称 Spring clamp assembly with electrically insulating shoe
摘要 A spring clamp and insulating shoe assembly is used to secure a finned heat sink to an electronic device package. The spring clamp body fits between or around fins or pins extending from one face of a heat sink and carries an insulating shoe which fits around the edge of the device package and has a lip which engages the opposite face of the device package to urge the device package and heat sink into mutual contact.
申请公布号 GB2283781(A) 申请公布日期 1995.05.17
申请号 GB19940017579 申请日期 1994.08.31
申请人 * THERMALLOY INC 发明人 DONALD L * CLEMENS;KEITH * MANDELL
分类号 H05K7/20;H01L23/40;(IPC1-7):H01L23/40 主分类号 H05K7/20
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