发明名称 |
Spring clamp assembly with electrically insulating shoe |
摘要 |
A spring clamp and insulating shoe assembly is used to secure a finned heat sink to an electronic device package. The spring clamp body fits between or around fins or pins extending from one face of a heat sink and carries an insulating shoe which fits around the edge of the device package and has a lip which engages the opposite face of the device package to urge the device package and heat sink into mutual contact. |
申请公布号 |
GB2283781(A) |
申请公布日期 |
1995.05.17 |
申请号 |
GB19940017579 |
申请日期 |
1994.08.31 |
申请人 |
* THERMALLOY INC |
发明人 |
DONALD L * CLEMENS;KEITH * MANDELL |
分类号 |
H05K7/20;H01L23/40;(IPC1-7):H01L23/40 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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