发明名称 |
Direct chip attach module |
摘要 |
A direct chip attach module (DCAM) 10 comprises one or more electronic components 30 bonded to a printed circuit on a substrate. The DCAM is bonded to an electronic circuit assembly by means of connection pads 50 formed on the edge of the DCAM substrate. This enables easy visual inspection of solder joints between the DCAM and the assembly. DCAM substrates 70 are provided in panel form and vias 50 are drilled and plated at predetermined connection points. The DCAM is then excised from the panel and the cut vias provide connection pads 50 on the edge of the substrate. <IMAGE> |
申请公布号 |
GB2283863(A) |
申请公布日期 |
1995.05.17 |
申请号 |
GB19930023646 |
申请日期 |
1993.11.16 |
申请人 |
* INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
ALAN PETER * DOWNIE;PETER * GALLAGHER;JOHN JOSEPH * GARRITY;BRIAN LESLIE * ROBERTSON |
分类号 |
H05K1/11;H01L25/04;H01L25/18;H05K1/14;H05K3/00;H05K3/34;H05K3/36;H05K3/40;H05K3/42;(IPC1-7):H05K1/18 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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