| 摘要 |
<p>PURPOSE:To obtain a thermosetting compsn. excellent in adhesion to a substrate, substrate-flattening effects, coating film toughness, heat resistances, weatherability, water resistance, etc., by incorporating an epoxy resin and a specific solvent into the compsn. CONSTITUTION:This thermosetting compsn. contains an epoxy resin and at least one solvent selected from the group consisting of a hydroxycarboxylic ester, an alkoxycarboxylic ester, a propylene glycol monoalkyl ester, and a propylene glycol ether ester. Pref. examples of the resin are polyglycidyl acrylate and a bisphenol A epoxy resin; pref. solvents are ethyl lactate and 3-methoxymethyl propionate. The compsn. may further contain a curative (e.g. phthalic anhydride), an adhesion promote (e.g. vinyltrimethoxysilane), a surfactant, etc.</p> |
