发明名称 MOLD FOR TRANSFER MOLDING APPARATUS
摘要 PURPOSE:To obtain a mold with improved sealing properties by providing a flow rate adjusting body which can project into a resin flow path communicating a mold space with a cull in at least one of the top and bottom forces between the mating face of which an article to be molded is pinched and can adjust the length of the projection. CONSTITUTION:A bottom mold die set 36 provides a plurality of pots 39 in series and a top mold chase 41 provides culls 2 facing each pot 39. Each cull 2 is connected with each other by a main runner and a top force sub-runner 4b provided by crossing this connects a main runner with a bottom force sub- runner 4a. A flow rate adjusting body 52 is inserted in a hole provided on the upper face of a top force chase 41 and is screwed in the inserting hole 54 and the apex is projected in the top force sub-runner 4b. Then, the length of the projection is adjusted by rotating the flow rate adjusting body 52 to make the molten resin flow simultaneously in each cavity 6.
申请公布号 JPH07124989(A) 申请公布日期 1995.05.16
申请号 JP19930276845 申请日期 1993.11.05
申请人 HITACHI LTD 发明人 TAKATSU KENJI;TABATA KATSUHIRO;SASAKI KAZUHIKO
分类号 B29C45/26;B29C45/02;B29C45/14;B29L31/34;H01L21/56;(IPC1-7):B29C45/02 主分类号 B29C45/26
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