发明名称 Cemented carbide substrate having a diamond layer of high adhesive strength
摘要 An improved process for improving the adhesion between a cemented carbide substrate and a diamond layer deposited thereon by removing the binder phase of the cemented material from the surface of the substrate prior to diamond coating. For this purpose, the process of the invention uses an apparatus as is conventionally used in various technologies for the CVD process of diamond layers. The process parameters are here altered from those of the conventional diamond coating in such a way that binder metal is evaporated from a very narrow boundary zone of the substrate surface, utilizing the reaction heat from the recombination of previously dissociated hydrogen gas directly at the substrate surface.
申请公布号 US5415674(A) 申请公布日期 1995.05.16
申请号 US19940217257 申请日期 1994.03.24
申请人 SCHWARTZKOPF TECHNOLOGIES CORPORATION 发明人 FEISTRITZER, STEFAN;KANZ, JOHANN;SCHINTLMEISTER, WILFRIED
分类号 C23C16/26;C23C16/02;C23C16/27;C23F4/00;(IPC1-7):B24D3/06;B05D3/00 主分类号 C23C16/26
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