| 摘要 |
An epoxy resin composition used for sealing of semiconductor devices, comprising as essential components: (A) an epoxy resin containing 50-100% by weight, based on total epoxy resin amount, of an epoxy compound represented by formula (I) <IMAGE> (I) wherein R1 to R8, which may be the same or different, are each an atom or group selected from the group consisting of hydrogen atom, halogen atoms and alkyl groups, (B) a phenolic resin curing agent containing 30-100% by weight, based on total phenolic resin curing agent amount, of a phenolic resin curing agent represented by formula (II) <IMAGE> (II) wherein R is paraxylylene group or a residual group which is obtained by removing two hydrogen atoms from dicylopentadiene, a terpene, cyclopentane or cyclohexane, and n is an integer of 0 to 4, (C) an inorganic filler, and (D) a curing accelerator.
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