| 摘要 |
A test clip is provided for IC (integrated circuit) devices of the SOP (small outline package) type which effectively positions the clip on the IC device, which facilitates manufacture of test clips for IC devices of different lengths, and which simplifies connection to the contacts of the test clip. The test clip includes a base (44, FIG. 1) with a cavity at its bottom which closely receives the body of the IC device (18), and a pair of arms (46, 48) pivotally mounted on the base and carrying rows of contacts (42). The cavity has opposite side cavity walls (82, 84) that lie adjacent to the sides of the body of the IC device, and end cavity walls (100, FIG. 5) that lie in interference fit with the ends (30) of the body. A group of test clips for IC devices having different numbers of leads at their opposite sides, have identical arms but have bases (44, 44A, FIG. 7) with different size cavities (80, 80A). A pair of flexible flat cables each has a lower end (60b, FIG. 2) connected to the tops of the contacts and an upper end (60u) directly connected to a header (66) that is directly mounted to the top of the base.
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