发明名称 Electroplating process and composition
摘要 A process for electroplating a nonconducting substrate comprising formation of a film of a conductive polymer on the surface of a nonconducting substrate and electrolytic deposition of metal thereover. The conductive film is formed by deposition of the conductive polymer onto said surface from an aqueous suspension of said polymer.
申请公布号 US5415762(A) 申请公布日期 1995.05.16
申请号 US19930108976 申请日期 1993.08.18
申请人 SHIPLEY COMPANY INC. 发明人 ALLARDYCE, GEORGE R.;BASS, KEVIN;GRAVES, JOHN E.;SHELNUT, JAMES G.
分类号 C25D5/54;H05K3/42;(IPC1-7):C25D5/54 主分类号 C25D5/54
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