发明名称 |
Electroplating process and composition |
摘要 |
A process for electroplating a nonconducting substrate comprising formation of a film of a conductive polymer on the surface of a nonconducting substrate and electrolytic deposition of metal thereover. The conductive film is formed by deposition of the conductive polymer onto said surface from an aqueous suspension of said polymer.
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申请公布号 |
US5415762(A) |
申请公布日期 |
1995.05.16 |
申请号 |
US19930108976 |
申请日期 |
1993.08.18 |
申请人 |
SHIPLEY COMPANY INC. |
发明人 |
ALLARDYCE, GEORGE R.;BASS, KEVIN;GRAVES, JOHN E.;SHELNUT, JAMES G. |
分类号 |
C25D5/54;H05K3/42;(IPC1-7):C25D5/54 |
主分类号 |
C25D5/54 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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