| 摘要 |
PURPOSE:To reduce the cost, to use for thin type electronic parts and to improve processing capacity. CONSTITUTION:A mask 5 is provided on the optical axis of a CW exiting Q switch pulse oscillating laser beam which is emitted from a laser beam oscillator 1 and the beam is scanned by forming the image of laser beam which is transmitted through a ring shaped pattern on the mask 5 with a beam expander 7, galvanometers 8 and 9 and an ftheta lens 10. Thus, machining depth in the width direction of a plotted line on a work 11 is uniformed and the maximum depth is made shallow and the thin type electronic parts are marked. A waveform of laser pulse is improved by making an oscillating time in one cycle of oscillating laser beam 20 musecond to 200musecond to contribute to reduce the machining depth and to improve visibility of marking. |
