| 摘要 |
PURPOSE:To obtain an adhesive tape for an electronic part with which adhesion and curing can be performed at a relatively low temp. and which has enough heat resistance and reliability by using an adhesive contg. a piperazinylethylaminocarbonyl group-contg. butadiene-acrylonitrile copolymer and a specified maleimide compd. CONSTITUTION:The adhesive used for the adhesive tape is constituted of a piperazinylethylaminocarbonyl group-contg. butadiene-acrylonitrile copolymer (a) with a wt. -average MW of 10,000-200,000, an acrylonitrile content of 5-50wt.%, and an amino equivalent of 500-10,000 and expressed by formula I (wherein k, m and n are each a molar ratio and k=3-175, m=0.3-93 and n=1) and a compd. (b) contg. at least two maleimide groups selected from compd. of formulas II, III and IV. 10-900 pts.wt. component (b) is compounded with 100 pts.wt. component (a). This adhesive layer is laminated on at least one face of a heat-resistance film. |
