RESIN COMPOSITION, RESIST INK COMPOSITION, AND CURED ARTICLE OF THE RESIST INK COMPOSITION

摘要

PURPOSE:To obtain a resin compsn. which can be developed with a dil. aq. alkali soln. even when the drying time for solvent removal is long and which gives a cured article excellent in adhesive properties and resistances to soldering heat, electroless gold plating, and electrolytic corrosion by using a specific unsatd. polycarboxylic acid resin as the main component. CONSTITUTION:This resin compsn. mainly comprises an unsatd. polycarboxylic acid resin obtd. by reacting the reaction product of a polyepoxy compd. with an unsatd. monocarboxylic acid compd. and a monocarboxylic acid compd. having at least one imide group with a polybasic acid anhydride. The compsn. forms a solder resist pattern with a good developability by developing parts unexposed to ultraviolet rays even when the drying time for solvent removal is long. Since the compsn. gives a cured article excellent in adhesive properties and resistances to electroless gold plating. electrolytic corrosion, and soldering heat, it is esp. suitable for a solder resist ink compsn.