| 摘要 |
<p>PURPOSE:To enable a rubber elastic body to be inserted into a cavity easily by making the rubber elastic body to be smaller than the outer diameter of the cavity and the thickness to be larger than the depth of the cavity and by hollowing out the inside. CONSTITUTION:A circuit substrate A where at least a die pat 1 for mounting electronic components and a circuit pattern 2 are provided, a pre-preg sheet B of normal resin flow where a penetration hole 41 of 10mmX10mm is formed, and a circuit substrate C where a penetration hole 41 of 10mmX10mm is formed are prepared. Also, the outer diameter is 9.5mmX9.5mm and a penetration hole of 4.0phi is formed inside and 8 kinds of rubber elastic bodies 6 which are 0.66mm, 0.64mm, 0.62mm, 0.60mm, 0.58mm, 0.56mm, 0.54mm, and 0.52mm are prepared. The circuit substrate C is piled up on the circuit substrate A and a recessed cut-out 5 is formed of the upper surface of the circuit substrate A, the wall surface of penetration hole of the prepreg sheet B, and the wall surface of the circuit substrate C. Then, a rubber elastic body 6 is inserted into this recessed cut-out 5 and is pressed and heated for forming one piece. After that, a multilayer circuit substrate for mounting electronic components is obtained by eliminating the rubber elastic body 6.</p> |
