发明名称 APPARATUS FOR PRODUCING PARTIALLY PLATED LEAD WIRE
摘要 PURPOSE:To facilitate changing of the kinds and patterns of partial plating layers of a lead wire and to previously eliminate the plating trouble at the time of welding parts by plating over the entire part. CONSTITUTION:A shielding resin applying stage, at least one piece of plating tanks 11 and shielding resin peeling stage through which a metallic blank wire 2 passes are arranged in series and further, this metallic blank wire is provided with sensor discriminating parts at a prescribed pitch interval in a press stage. The shielding resins are previously partially applied at every pitch to such metallic blank wire 2. As a result, the partial plating layers are formed at every pitch in the plating tanks.
申请公布号 JPH07126884(A) 申请公布日期 1995.05.16
申请号 JP19930303415 申请日期 1993.11.08
申请人 KYOWA DENSEN KK 发明人 SATO MASAHIRO;HARIMA KEIJI
分类号 C25D5/02;C25D7/06;H01L23/48;(IPC1-7):C25D5/02 主分类号 C25D5/02
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