Cicuit and process of manufacturing the circuit

摘要

PCT No. PCT/DE91/00709 Sec. 371 Date Mar. 18, 1993 Sec. 102(e) Date Mar. 18, 1993 PCT Filed Sep. 6, 1991 PCT Pub. No. WO92/05677 PCT Pub. Date Apr. 2, 1992.In a process for manufacturing a circuit including a first circuit plane of a ceramic substrate which is covered with, for example, thick-film structures and is imprinted with corresponding conductor paths having contact faces, the ceramic substrate is to be connected with a second circuit plane composed of a green tape substrate.