发明名称 SEMICONDUCTOR DEVICE AND ITS MOLDING METHOD
摘要 PURPOSE:To make the device compact, by sealing the photo detection element with transparent resin and the control element with opaque resin, interrupting the incidence of external light to the control element, and enabling transfer mold with one metal mold. CONSTITUTION:The photo detection element 100 and the control element 200 are placed on the terminal member 300, and the photo detection element is sealed with transparent resin 400 and the control element is with opaque resin 500. The external lead 300 a of the terminal 300 is projected and resin is injected between the enclosure and the photo detection element and filter is attached. Thus, the constitution is made that first, the photo detection element 100 and the control element 200 are located to the terminal 300 and it is contained in the metal mold 1000. Transparent resin 400 flows from the path C and opaque resin 500 from the path D, and sealing is made with one transfer molding. Thus, the signal detected with the photo detection element 100 can be outputted correctly with the control element 200.
申请公布号 JPS54109389(A) 申请公布日期 1979.08.27
申请号 JP19780015877 申请日期 1978.02.16
申请人 TOKYO SHIBAURA ELECTRIC CO 发明人 TANAKA TOSHIAKI
分类号 H01L31/02 主分类号 H01L31/02
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