| 摘要 |
PURPOSE:To provide a package for power semiconductor device which is advantageous to the connection between an external control circuit and snubber circuit. CONSTITUTION:Supporting terminals 6 for fixing the printed wiring board of an external control circuit and connection terminals 7 for snubber circuit which are led out after being connected to DC input terminals at the same potential are installed in parallel with a pin terminal row 3 on the upper surface of a package 1 incorporating such a power chip as the IGBT, etc., of a semiconductor device equipped with main circuit leading-out terminals 2 for DC input and AC output and the pin terminals 3 connected to the external control circuit which are separately arranged on the upper surface of the package 1 in two rows. At the time of using this semiconductor device as a power device, the printed wiring boards of the external control and snubber circuits are connected to the semiconductor device in such a state that the wiring boards are placed on the terminals 6 and 7. |
