SEMICONDUCTOR DEVICE AND FABRICATION THEREOF

摘要

PURPOSE:To allow easy formation of a contact hole even when the height from the surface of a semiconductor substrate to the upper surface of an interlayer insulation film increases due to high integration of a semiconductor device. CONSTITUTION:A wiring pad 12a is formed on an N well potential fixed region 6 and a contact hole 13c is made through an interlayer insulation film 13 deposited thereon.