| 摘要 |
PURPOSE:To reduce the dispersion of resin, which is applied on a semiconductor element mounted on a substrate and the surrounding part of the semiconductor element by forming the tip of a nozzle in the slant pattern, and providing the leading tip so that the tip is approximately in contact with the substrate. CONSTITUTION:A tip 21 of a nozzle 18 comprises stainless steel. A pipe is formed at the inclination of about 15 deg.. A part of the halfway of a small-diameter part 20 comes into contact with the tip of a nozzle supporting part 14. Thus, the small-diameter part 20 and the tip 21 are inclined by about 40 deg.-50 deg. with respect to a vertical line. Then, the upper and lower positions of a container 15 are adjusted so that a distance A between the tip 21 of the nozzle 18 and the side surface of a light emitting diode 28 becomes 0.3-0.7mm, and the container 15 is fixed to a head 5. The leading tip of the nozzle 18 is brought into contact with the surface of a substrate by pushing a key. Thus, the position in the direction Z is determined. Resin is applied from the tip formed in the inclined pattern on the surface of the substrate, a semiconductor element and the surrounding part thereof. |
