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发明名称
WIRING STRUCTURE FOR SEMICONDUCTOR DEVICE, FORMATION OF WIRING AND THIN SILVER FILM, CVD SYSTEM AND CHEMICAL/ MECHANICAL POLISHING METHOD
摘要
申请公布号
JPH07122642(A)
申请公布日期
1995.05.12
申请号
JP19930289807
申请日期
1993.10.27
申请人
SONY CORP
发明人
SUMI HIROBUMI
分类号
H01L21/28;H01L21/285;H01L21/3205;H01L21/768;H01L23/52;(IPC1-7):H01L21/768;H01L21/320
主分类号
H01L21/28
代理机构
代理人
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