发明名称 THERMOCOMPRESSION TOOL, BUMP FORMATION AND LEAD JOINT
摘要 PURPOSE:To form a high quality precise bump on an electrode pad by thermocompression and to joint a lead to a member to be jointed while suppressing damage thereon with high alignment accuracy. CONSTITUTION:A highly accurate high quality metal ball 15, previously formed stably in metallurgical sense, is sucked selectively to the tip of a capillary tool 3. The metal ball 15 is then deformed by thermocompression on a member to be compressed, e.g. an electrode pad, thus forming a nail head bump. A lead is superposed on the member to be bonded and the metal ball is pressed against the lead to form a stitch bump thus bonding the lead and the member to be bonded collectively.
申请公布号 JPH07122561(A) 申请公布日期 1995.05.12
申请号 JP19930287700 申请日期 1993.10.22
申请人 SONY CORP 发明人 YAMAMOTO HIDEHARU
分类号 H01L21/60;B23K3/06;B23P21/00;H01L21/321;H05K3/34 主分类号 H01L21/60
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