| 摘要 |
PURPOSE:To manufacture a lead frame at a low cost in a short time as compared with development or purchase of a novel lead frame by utilizing an old lead frame effectively while dealing with the downsizing of a semiconductor chip. CONSTITUTION:The semiconductor integrated circuit device comprises a semiconductor chip 11, a die pad part 12, a lead frame 15 comprising an inner lead part 13 and an outer lead part, and a TAB film 16 applied with a conductor foil on one main surface thereof, wherein the TAB film 16 is bonded with a Cu foil 20 and an adhesive 21 sandwiching a film 19. The Cu foil 20 of the TAB film 16 and the inner lead part 13 of the lead frame 15, and the film 19 and the die pad part 12 are bonded, respectively, through the adhesive 21 by thermocompression. Subsequently, the semiconductor chip 11 is mounted and connected through a wire 17 before being sealed with resin. |
