| 摘要 |
PURPOSE:To enhance reliability to vibration by installing a means to increase bonding strength between a pad for mounting a lead frame of a printed circuit board and a resin part of the printed circuit board in the printed circuit board. CONSTITUTION:A pad 3 made of a copper foil and a copper plating layer on the copper foil is installed on the surface and on the back side of a lead frame mounting part of a printed circuit board 1. A through hole 8 whose inside surface is copper plated, passing through the pad 3 and a resin part of the board 1 is installed. Solder plating 4 is conducted on the pad 3 and on the inside of the through hole 8. A lead frame 2 is composed of mounting parts 5, 5' of the board 1 and a lead 2a for external connection, and the mounting parts 5, 5' are made in nearly U-shaped form with weak spring action. The pad 3 of the board 1 is interposed between the mounting parts 5, 5', and soldered with solder 6. Mechanical strength in the bonding part of the board 1 to the lead frame 2 is increased. |
