| 摘要 |
<p>PURPOSE:To provide the cooling method and device for the semiconductor wafer which can be shorten in cooling time. CONSTITUTION:The cooling device 20 equipped with a cooling plate 2 for the semiconductor wafer 1, its heat radiation plate 3, a thermomodule 4 between them, a control sensor 5 which outputs the temperature signal of the cooling plate 2, a PID arithmetic mechanism which processes the cooling target temperature signal of the cooling plate 2 and the output signal of the control sensor 5, and a driving circuit 6 for the thermomodule brought under the PID control of the arithmetic mechanism is provided with a sensor 21 for wafer temperature measurement which measures the temperature theta of the semiconductor wafer 1 mounted on the cooling plate 2, a relay element which operates when the difference between the measured temperature theta of the sensor and cooling target temperature theta pest is large to place the driving circuit 6 in full operation and stops operating when the difference reaches a specific difference, and a control changeover switch which switches the driving circuit between the full operation and PID control through the ON/OFF operation of the relay element.</p> |
