| 摘要 |
PURPOSE:To prevent the up and down movement and the inclination of a semi conductor chip with the pressure of molten resin, which is injected into a forming metal mold. CONSTITUTION:A plurality of protruding parts 30 of resin or metal having the height corresponding to the thickness of sealing resin 12 is provided on the surface and/or rear surface of a semiconductor chip, or on the rear surface of the die pad of a lead frame. The end part of the protruding parts 30 are brought into contact with cavity faces 43A and 44A of upper and lower metal molds 43 and 44 of a forming metal mold. Under this state, molten resin M is injected, and resin sealing is performed. Therefore, the stay shift of the semiconductor chip can be suppressed by the presence of a plurality of the protruding parts 300. Therefore, wire breakdown can be prevented, the contact of inner leads and the edge of the semiconductor chip 10 can be avoided and the yield rate is improved.
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