| 摘要 |
PURPOSE:To employ a Al wire in order to eliminate drawbacks of Au wire or solder and to allow formation of uniform bump electrode by mechanical operation of a wire bonder. CONSTITUTION:A thin Al wire W made by adding 0.5-3.0wt.% of Mg to pure Al is inserted into a capillary 3 and the tip thereof is thermally fused by arc discharge in the reducing atmosphere of Ar-10% H2 gas thus producing a ball W'. The ball W' is bonded to the upper face of an Al pad 2 in a semiconductor chip 1 and then the capillary 3 is pulled up thus cutting off the wire W at the predetermined root part of the ball W'. Consequently, a bump electrode (a) is formed on the upper face of the pad 2 while leaving a neck a 1 of predetermined height (h). |
