| 摘要 |
PURPOSE:To provide a semiconductor device, which can achieve the thinning of the device and can readily mount a semiconductor element on an island part. CONSTITUTION:Step parts 10a are formed St least at both side ends at the rear side of a semiconductor element 10. A protruding part 10b is formed at the rear surface side of the semiconductor element. A hollow part 10a, wherein the protruding part 10b of the semiconductor element 10 is inserted, is formed at an island part 11 of a lead frame, on which the semiconductor element 10 is mounted. The semiconductor element 10 is inserted down into the hollow part 11a of the island part 11 by a height L1 of the step part 10a. Therefore, the total thickness of the semiconductor element 10 and the island part 11 becomes thin by the height, and the thinning of the device can be achieved. The position of the semiconductor element 10 is determined at the island part 11 through the protruding part 10b and the hollow part 11a. Therefore, the semiconductor element 10 can be readily mounted on the island part 11. |
