| 摘要 |
PURPOSE:To obtain a thin high quality board for mounting a semiconductor element at low manufacturing cost by laminating an adhesive layer and a fine powder layer sequentially onto a power, supply conductor layer and a ground conductor layer when the power supply conductor layer, the ground conductor layer and an inner lead layer are formed on a base material. CONSTITUTION:A powers supply conductor layer 14, a ground conductor layer 15, and an inner lead layer 16 are laminated sequentially, while being insulated and exposing the edge side sequentially from the bottom, on an insulating board 12 having high thermal conductivity, e.g. a glass epoxy board. The conductor layer 14-16 is provided on an insulating adhesive layer 17 or a fine glass powder layer 18. A large number of plating through holes 19 are made at the outer edge fringe of the basic material 12 and the leads from respective adhesive layers 17 are connected with the power supply conductor layer 14, the ground conductor layer 15 and the upper part of corresponding plating through hole. |
