| 摘要 |
<p>PURPOSE:To reduce the supply inductance noise of a semiconductor integrated circuit device, especially, QFP having a multilayered lead frame structure by fetching a power supply layer and ground layer in a package at low impedances. CONSTITUTION:An LSI 1 composed of a QFP having a multilayered lead frame structure. The LSI 1 has a semiconductor chip 2 incorporated in a package molded with a resin 7 and the connection pads of the chip 2 are respectively connected to a signal, power supply, and ground lead frames 3, 4, and 5 through wires 6. The lead frames 4 and 5 respectively have a power supply layer 11 and ground layer 14 and outer leads 12 and 15 having larger areas than the outer leads 9 of the lead frame 3 have are directly led out from the layers 11 and 14.</p> |
