| 摘要 |
PURPOSE:To enhance heat dissipation effect of two layer scribe wiring structure by connecting two metal wiring layers thereof directly with a semiconductor substrate thereby spreading the heat from each metal wiring layer to the semiconductor substrate. CONSTITUTION:Two Al wiring layers 5, 7 constituting a scribe wiring are interconnected through a contact CNT. Both Al wiring layers 5, 7 are connected directly with the P<+> type impurity diffusion layer 3 of a semiconductor substrate 1. Since both Al wiring layers 5, 7 are connected with the semiconductor substrate 1, heat dissipation effect can be enhanced through thermal conduction. |
