Process for wave soldering using lead-free solders

摘要

The invention relates to a process for wave soldering subassemblies, in particular printed-board assemblies, with shielding of the surroundings, in which lead-free or at least low-lead solders, in particular tin solders, having a melting point of more than 210 DEG C are used. Since in wave soldering, the solder bath temperature usually has to be set significantly higher than the melting point of the respective solder, overheating problems in the components to be soldered occur with the relatively high-melting, lead-free or low-lead solders. As a solution to this problem, it is proposed according to the invention that a solder bath temperature of only a few degrees Celsius above the melting point of the respective solder be set and that the wave soldering process be carried out under the plasma action of a process gas atmosphere under low pressure.