Device for desoldering components from a board, or soldering components to a board

摘要

A device is provided for desoldering components from a board or soldering components to a board, heat being transmitted by means of steam, via the rear side of the board, to the component soldering points, and the board additionally being heated. The advantages of the invention are that it can be used for soldering densely fitted assemblies and components which are seated in undercuts or on multilayer printed circuit boards. The invention is preferably used in the case of electronic components on printed circuit boards.